| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant resin precursor composition having slight deterioration of adhesive characteristics of a film after heat-curing to a package material such as an epoxy resin under high-temperature and high-humidity conditions and to provide a semiconductor device using the composition. <P>SOLUTION: The heat-resistant resin precursor composition comprises a polybenzoxazole precursor or a polyimide precursor, which is a polyhydroxyamide resin consisting essentially of a repeating unit represented by a condensed segment and a diamine derivative having hydroxy groups in the main chain, and or which is a resin consisting essentially of a repeating unit represented by a condensed segment and a dicarboxylic acid derivative having hydroxy groups in the main chain. In the repeating unit, the condensed segment composed of a diamine containing hydroxy groups in a 6-30C organic group containing an aromatic ring or an aromatic condensed ring and a dicarboxylic acid containing a similar ring is a both end-dicarboxylic acid-terminated derivative. Furthermore, the condensed segment composed of a diamine containing hydroxy groups in a 6-30C organic group containing an aromatic ring or an aromatic condensed ring and a dicarboxylic acid containing a similar ring is a both end-diamine-acid-terminated derivative. <P>COPYRIGHT: (C)2008,JPO&INPIT |
