| 摘要 |
PROBLEM TO BE SOLVED: To improve processing accuracy of a wafer chuck plate by suppressing bending and resonance (chattering vibration) of the wafer chuck plate by cutting force of a tool to make flatness of the wafer chuck plate highly accurate. SOLUTION: In this method and device, a chuck surface on a rear face side of the wafer chuck plate is processed by the tool for processing the chuck surface by spraying fluid to the rear face of the chuck opposed in a cutting direction of the tool. While the wafer chuck plate is rotated, a peripheral edge part of the chuck surface is processed by the tool. Fluid compressed air is sprayed to the rear face of the chuck opposed in the cutting direction of the tool. As a result, bending and resonance (chattering vibration) of the wafer chuck plate by the cutting force of the tool are suppressed to make flatness of the wafer chuck plate highly accurate and to improve processing accuracy of the wafer chuck plate. COPYRIGHT: (C)2008,JPO&INPIT |
