发明名称 |
Method of fabricating anti-warp package |
摘要 |
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location underneath the surrounding area of the chip. Through the disposition of a stiffening member, warping stress on the packaging substrate when the chip is encapsulated by molding compound is counterbalanced. |
申请公布号 |
US7352071(B2) |
申请公布日期 |
2008.04.01 |
申请号 |
US20040904760 |
申请日期 |
2004.11.26 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
YEE KUO-CHUNG |
分类号 |
H01L23/29;H01L21/48;H01L21/50;H01L21/56;H01L23/16;H01L23/28;H01L23/31 |
主分类号 |
H01L23/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|