发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR INTERLAYER INSULATION FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for interlayer insulation films capable of obtaining an interlayer insulation film having high transparency. <P>SOLUTION: In the photosensitive resin composition for interlayer insulation films, a copolymer (A1) having a constitutional unit (a1) represented by formula (a-1) and a constitutional unit (a2) having a crosslinkable group is comprised as an alkali-soluble resin component (A) and a condensate of a quinonediazide group-containing compound and a phenolic hydroxyl group-containing compound is comprised as a photosensitizing agent (B), wherein the phenolic hydroxyl group-containing compound has a thermal decomposition temperature of &ge;300&deg;C. In the formula, R<SP>0</SP>represents H or a methyl group; R<SP>1</SP>represents a single bond or a 1-5C alkylene group; R<SP>2</SP>represents a 1-5C alkyl group; a represents an integer of 1-5, b represents 0 or an integer of 1-4, a+b&le;5; and when two or more symbols R<SP>2</SP>are present, these symbols R<SP>2</SP>may be different from each other or the same. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008040185(A) 申请公布日期 2008.02.21
申请号 JP20060215107 申请日期 2006.08.07
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MIYAGI MASARU;SUGIMOTO YASUAKI;TATENO ISAO;NAKAO TAKU
分类号 G03F7/023;G02B5/20;H01L21/312 主分类号 G03F7/023
代理机构 代理人
主权项
地址