| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for electrical component preventing damages of a mold guide. SOLUTION: A fixed contact piece which makes a pair with a movable contact piece is formed on a contact pin installed on a socket body 13. A fixed side contact part 15d to contact the lower face side of an IC lead of an IC package is formed on the fixed contact piece, while a plurality of slits 13j penetrating in vertical direction are formed at prescribed intervals at the mold guide 13h. A movable side contact part 15g is inserted in each slit 13j and the upper end part of the movable side contact part 15g is brought to the upper part. COPYRIGHT: (C)2008,JPO&INPIT |
