COATING APPARATUS AND METHOD

摘要

The invention relates to the provision of apparatus and a method which ca n be used to allow the sputter deposition of material onto at least one arti cle to form a coating on the same. The new form of magnetron described herei n allows an increase in sputter deposition rates to be achieved at higher po wers and without causing damage to the coating is created. This can be achie ved by improved cooling and use of a relatively high magnetic field in the m agnetron while at the same time increasing the power to the magnetron by inc reasing the current at a rate faster than the voltage.