发明名称 METHOD FOR SEPARATING MOLDED BODY FROM A RESIN MOLD
摘要 A method for separating a molded body from a resin mold is provided to prevent a part of the molded body formed in a port from being broken when the molded body is separated from the resin mold. A method for separating a molded body(M) from a resin mold includes a step of inputting the protrusion start position of a pin(11) for separating the molded body, a step of inputting the thickness of the molded body formed in a port(12) of the resin mold, a step of permitting a resin compression unit(13) arranged in the port to compress resin such that the resin is injected to a semiconductor element, a step of permitting the resin compression unit to stop compression in accordance with the input thickness of the molded body, and hardening the resin, a step of permitting the resin compression unit to descend to the pre-composition position in the port at least once and ascend to the position of stopping compression, a step of permitting the pin to reach the protrusion start position, and a step of separating the molded body by permitting the resin compression unit to ascend together with the pin.
申请公布号 KR100793273(B1) 申请公布日期 2008.01.10
申请号 KR20060137789 申请日期 2006.12.29
申请人 SECRON CO., LTD. 发明人 JUNG, BYOUNG HO;LEE, JI SUNG
分类号 B29C33/44;B29C33/46 主分类号 B29C33/44
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