摘要 |
A method for separating a molded body from a resin mold is provided to prevent a part of the molded body formed in a port from being broken when the molded body is separated from the resin mold. A method for separating a molded body(M) from a resin mold includes a step of inputting the protrusion start position of a pin(11) for separating the molded body, a step of inputting the thickness of the molded body formed in a port(12) of the resin mold, a step of permitting a resin compression unit(13) arranged in the port to compress resin such that the resin is injected to a semiconductor element, a step of permitting the resin compression unit to stop compression in accordance with the input thickness of the molded body, and hardening the resin, a step of permitting the resin compression unit to descend to the pre-composition position in the port at least once and ascend to the position of stopping compression, a step of permitting the pin to reach the protrusion start position, and a step of separating the molded body by permitting the resin compression unit to ascend together with the pin.
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