Vertical conduction power electronic device package and corresponding assembling method

摘要

A vertical conduction power electronic device package (1) and corresponding assembly method comprising at least a metal frame (2) suitable to house at least a plate or first semiconductor die (16,35) having at least a first (17) and a second conduction terminal (18) on respective opposed sides of the first die (16,35). The first conduction terminal (17) being in contact with said metal frame (2) and comprising at least an intermediate frame (23,24) arranged in contact with said second conduction terminal (18).