METHOD OF PACKAGING SEMI-CONDUCTOR

摘要

A method for packaging a semiconductor is provided to avoid warpage of a PCB and a wafer while shortening an interval of process time by uniformly depositing paste on a wafer in a semiconductor packaging process and by reduce an interval of B-staging time. Die attach paste with viscosity of 1500-100000 cps is prepared. The die attach paste of a predetermined thickness is coated on a wafer by using a spin coater. A B-staging process is performed on the coated paste. In the B-staging process, a thermal dry process is performed on the coated paste at a temperature of 40-200 °C.