| 摘要 |
A camera module assembly is provided to improve the yield rate by employing a contact point scheme of a printed circuit board using the pad provided at the lower portion of the printed circuit board. A camera module assembly includes a camera module, a printed circuit board(110), a plurality of pads and a socket(200). The camera module is equipped with a lens(121) used to take a picture. The printed circuit board(110) is fixed to the bottom surface of the camera module. The pad is provided in the printed circuit board(110) and electrically connected to the camera module. The socket(200) is coupled to the printed circuit board and electrically connected to the pad. The pad is plated at the lower portion of the printed circuit board(110). |
