| 摘要 |
There is provided a thermally conductive composition including: a thermally conductive filler, and a binder component. The thermally conductive filler includes: a particulate central portion comprising metal aluminum, and an electrically-insulated oxide layer having an average thickness of 500 nm or more formed on a surface of said central portion. The thermally conductive composition is capable of giving a thermally conductive sheet which has high thermal conductivity, which may not cause a problem such as a short circuit even if it is disposed in an integrated circuit (IC), or the like, and which has superior reliability.
|
