METHOD OF FABRICATING LED PACKAGE

摘要

A method for manufacturing an LED package is provided to form a pattern on a resin package by using a soft stamp having resilient characteristic, thereby forming the pattern simply and uniformly. LED chips(205) mounted on LED package structures(210 to 240) are sealed with a liquid transparent resin. Before the liquid transparent resin is cured, a predetermined recessed pattern is imprinted on a surface of the liquid transparent resin by using a soft stamp(100) made of polymer material and a recessed pattern. The liquid transparent resin is cured to form a resin package. The soft stamp is removed from the LED package structure.