发明名称 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
摘要 A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I), wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar<SUP>1</SUP> is a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar<SUP>2</SUP>
申请公布号 WO2004111726(A3) 申请公布日期 2007.06.28
申请号 WO2004US17486 申请日期 2004.06.03
申请人 FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 发明人 RUSHKIN, IILYA;NAIINI, AHMAD, A.;HOPLA, RICHARD;WATERSON, PAMELA, J.;WEBER, WILLIAM, D.;POWELL, DAVID, B.
分类号 G03F7/023;G03C1/73;G03F;G03F7/038;G03F7/075;G03F7/30 主分类号 G03F7/023
代理机构 代理人
主权项
地址