| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which the necessity of a mask film is eliminated, a resist material is changed to a recyclable and non-photosensitive one for recycling, a working area provided with lighting subjected to non-exposure of a resist is eliminated, and the reduction of the number of steps and of cost as well as the improvement of quality can be realized as a result. SOLUTION: A metal resist layer 3 separatable and removable by a laser 4 is formed by plating or laminating a metal foil on a copper layer 2 which is formed on the surface of a substrate 1 as a wiring pattern 5 by plating or laminating a copper foil. The unnecessary part 6 of the metal resist layer 3 not aligned with the specified wiring pattern 5 is removed by the laser 4. Thereafter, the exposed copper layer 2 is removed by an etching liquid, and the metal resist pattern 7 on the wiring pattern 5 is removed by a peeling-off liquid to form a specified pattern on the substrate 1. COPYRIGHT: (C)2007,JPO&INPIT
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