发明名称 CERAMIC MULTILAYER SUBSTRATE AND ITS PRODUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate which facilitates circuit design while exhibiting excellent high frequency characteristics. SOLUTION: The ceramic multilayer substrate 10 has insulation layers 11A-11E composed of low temperature fired ceramics and conductive layers 12A-12E laminated alternately. The conductive layers 12A-12E are constituted of a conductor pattern 13 having an arbitrary plane shape, and an insulator spacer 14 formed in a region other than the region of the conductor pattern 13. Since the insulator spacer 14 plays a role for preventing deformation in cross-sectional shape of the conductor pattern 13 when it is hot pressed, rectangular cross-section of the conductor pattern 13 is sustained even after the ceramic insulation layers 11A-11E and the conductive layers 12A-12E are laminated alternately and hot pressed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165615(A) 申请公布日期 2007.06.28
申请号 JP20050360313 申请日期 2005.12.14
申请人 TDK CORP 发明人 KAMIYA TAKASHI;NAKAI SHINYA
分类号 H05K3/46;H01L23/13 主分类号 H05K3/46
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