FIXED ABRASIVE POLISHING PAD, METHOD OF PREPARING THE SAME, AND CHEMICAL MECHANICAL POLISHING COMPRISING THE SAME

摘要

A fixed abrasive polishing pad is provided to contain slurry in an opening formed on the adhesion surface of a polishing layer and a polished layer of a wafer by including a polishing layer with an opening on a base. A fixed polishing pad protrudes from a base(32), including a polishing layer(31) having a polishing particle(36) and an opening. The opening can be a pore(38). The area of the opening can be 5~30 percent of the area of the polishing layer. One of a ceria particle, a silica particle or an alumina particle can be selected as the polishing particle.