| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for preventing a non-conductive adhesive material from being pinched at a junction, without causing displacement of bumps, when two substrates are mounted via the bumps, and to provide a semiconductor device mounted therewith. SOLUTION: The mounting method includes a first step for forming the bumps 30, to at least one of first/second electrode pads 20, 21 provided on each one face side of the first/second substrates 10, 11; a second step for arranging the non-conductive adhesive material 40, having a thickness smaller than the height of the bumps 30 on each one face side of the first/second substrates 10, 11, where the bumps 30 are formed so as to protrude each tip part of the bumps 30; and a third step for connecting the bumps 30 with each other or the bump 30 and the first or second electrode pad 20 or 21, to which the bumps are not formed, by friction of supersonic vibration, while pressure-bonding each of the face side of the first/second substrates 10, 11 facing each other via the non-conductive adhesive material 40, by imparting supersonic vibrations to at least one of the first/second substrates 10, 11. COPYRIGHT: (C)2007,JPO&INPIT
|
