| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus with a less working amount of workers, which is capable of restraining the amount of resin used for sealing from being varied. SOLUTION: The semiconductor manufacturing apparatus associated with the present invention comprises: a conveyance stage 10 by which a plurality of semiconductor elements 1 are continuously conveyed; resin applying means 30 disposed above the conveyance stage 10 for applying sealing resin on a semiconductor element 1; weight measuring means 12 for measuring the weight of the semiconductor element 1 after the application of the resin; and a control unit 20 for controlling the amount of the application of the resin by the resin application means 30, on the basis of a measurement result of the weight measuring means 12. When the resin applying means 30 applies resin using air, the control unit 20 controls the amount of the air to control the amount of the application of the resin. COPYRIGHT: (C)2007,JPO&INPIT
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