| 摘要 |
A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole.The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.
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