| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield structure of an electronic apparatus whose thickness of the whole electronic apparatus is reduced by decreasing a space inside a case needed in the shield structure of the prior electronic apparatus, when using printed wiring boards stacked inside a case. SOLUTION: The shield structure of electronic apparatus includes a printed wiring board 12 which has a circuit chip 21 and a shield frame 31 surrounding the circuit chip 21, and a printed wiring board 11 where a shielding copper foil pattern 33 is formed. The shield structure is constructed in a manner such that the opening of shield frame 31 of the printed wiring board 12 and the shielding copper foil pattern 33 of the printed wiring board 11 are contacted with each other, when assembling the printed wiring boards 11, 12. COPYRIGHT: (C)2007,JPO&INPIT
|
