A power semiconductor device

摘要

The object of the invention is to provide a power semiconductor module having solder joints that are highly reliable for temperature cycles. In a power semiconductor module of the present invention, a solder joint between a metal circuit pattern and metal terminal on an insulation substrate is formed by covering, from above, a high melting point solder, which is joined on the metal circuit pattern and has a prescribed thickness, with a low melting point solder and then joining the metal terminal with the low melting point solder.