| 摘要 |
A photo-detecting semiconductor package is provided to simplify a fabricating process by reducing the size of a solder bump mounted on a substrate. A substrate is prepared which is made of a generally transparent material with respect to light having a wavelength of a predetermined scope wherein the substrate includes a receiving groove having a predetermined size and a placement surface(27) formed by the receiving groove. A metal pattern is extended from the inside of the receiving groove to the placement surface. A photo-detecting die includes a photo-detecting region for detecting light having a wavelength of a predetermined scope and a solder bump pad(19) electrically coupled to the photo-detecting region wherein the photo-detecting region is inserted into the receiving groove so that the photo-detecting region is disposed to confront the inside of the receiving groove and the solder bump pad is coupled to the upper part of the metal pattern. A solder bump(15) is formed on the metal pattern positioned on the placement surface so as to be mounted on an external circuit. The receiving groove includes a lower surface and a tilted surface extended from the lower surface. The metal pattern is formed on a part of the lower surface and the tilted surface to be extended to the placement surface.
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