Electronic package having underfill standoff and method

摘要

An electronic package (10) having a controlled standoff height between a surface mount device (16) and a circuit board (12). The electronic package (10) includes a circuit board (12) having a substrate and circuitry including mounting pads (14) and a surface mount device (16) having circuitry and contact terminals (18). Solder joints (20) connect the contact terminals (18) of the surface mount device (16) to the mounting pads (14) on the circuit board (12). A dielectric underfill (22) is disposed between the circuit board (12) and the surface mount device (16), and a plurality of filler particles (24) are disposed in the underfill material (22) to provide a separation distance between the circuit board (12) and the surface mount device (16).