| 摘要 |
A semiconductor chip package is provided to maintain high resolution even when a data pitch is reduced, by bonding chips of a semiconductor chip package to both surfaces of a film wherein the semiconductor chip package transfers a signal between a printed circuit board and a liquid crystal panel. A conductive pattern is formed on both surfaces of a base film(210), made of a copper pattern. The base film can be a polyimide film. A first chip(220) is bonded to one surface of the base film. A second chip(230) is bonded to the other surface of the base film. A liquid crystal display includes a semiconductor chip package composed of the base film, the first chip and the second chip.
|
