| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that for a semiconductor element formed by mounting an optical semiconductor chip on a lead frame, the method of mounting the semiconductor chip in a recess surrounded with a mold resin on the frame is proposed but, because of a poor thermal conductivity of the mold resin, it is difficult to escape much heat well around from a high power laser diode. SOLUTION: The front end of a lead frame is bent to improve the heat radiation with protecting a laser diode chip. COPYRIGHT: (C)2007,JPO&INPIT
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