| 发明名称 |
Encapsulation method for SBGA |
| 摘要 |
A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip and a portion of the substrate. |
| 申请公布号 |
US7154185(B2) |
申请公布日期 |
2006.12.26 |
| 申请号 |
US20030718191 |
申请日期 |
2003.11.20 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LEE HSIN-HUI;TSAO PEI-HWA;SU CHAO-YUAN |
| 分类号 |
H01L23/48;H01L21/44;H01L21/50;H01L21/56;H01L21/58;H01L23/00;H01L23/16;H01L23/31;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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