| 摘要 |
The present invention relates to a semiconductive composition and a power cable using the same. The semiconductive composition according to the present invention constituting a semi-conductive layer of a power cable includes 100 parts by weight of a base resin composed of an ethylene-based copolymer resin; 45 to 70 parts by weight of a carbon black; and 0.2 to 5.0 parts by weight of a nonionic surfactant. The semiconductive composition according to the present invention has an improved interfacial smoothness in the semiconductive layer and the insulation layer of the power cable and an increased dielectric breakdown strength of the insulation layer. Also, the semiconductive composition according to the present invention may be useful to ensure an easy cleaning property of a mold upon extruding/molding a power cable. |
