| 摘要 |
PROBLEM TO BE SOLVED: To provide a new epoxy compound having a low melting point and providing a raw material for a cured product of an epoxy resin. SOLUTION: The new epoxy compound is represented by formula (1) äwherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>and R<SP>6</SP>are each the same or different and represent each a hydrogen atom, a halogen atom, a 1-8C alkyl group or a 1-8C alkoxy group; and Z represents a 2-18C linear or a 2-18 branched chain alkylene group (wherein, one or non-adjacent two or more methylene groups constituting the 2-18C linear or 2-18C branched chain alkylene group may be substituted with an oxygen atom)}. COPYRIGHT: (C)2007,JPO&INPIT |
