| 摘要 |
PROBLEM TO BE SOLVED: To electrically join a first terminal and second terminal with high reliability. SOLUTION: When a terminal 51 is formed at FPC 50, a core 52 is formed and a solder film 53 is formed on the surface of the core 52. At this point, the core 52 and the solder film 53 are so formed that the ratio of the height from the lower face 40a of the FPC 50 to the core 52 and the film thickness of the solder film 53 may be in a range of 1:1 to 2:1. When the terminal 51 of the FPC 50 and the land 36 of an actuator unit 21 are joined, the terminal 51 is heated while the terminal 51 is pushed to a land 36 under pressure. COPYRIGHT: (C)2007,JPO&INPIT |
