| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board material for electronic devices and a printed circuit board improved in adhesion, crack resistance and heat resistance. SOLUTION: The present invention provides (1) a cyano group-containing thermosetting benzoxazine resin produced by reacting (a) a bifunctional phenol resin with (b) an aldehyde compound, (c) an amine compound containing one or more cyano groups and a primary amino group in one molecule and (d) an amine compound other than the component (c) containing one or more primary amino groups in one molecule, and (2) a thermosetting resin composition containing an epoxy resin having two or more epoxy groups in one molecule and its application. COPYRIGHT: (C)2006,JPO&NCIPI |
