发明名称 |
CURABLE COMPOSITION, SEALANT AND ADHESIVE |
摘要 |
PROBLEM TO BE SOLVED: To provide a low-viscosity and thixotropic curable composition curing by ambient humidity and giving a rubbery cured product, and to provide a sealant and an adhesive each using the composition. SOLUTION: The curable composition comprises (a) an organic polymer containing crosslinkable hydrolyzable silyl group and (b) an organic polymer with a number-average molecular weight of 500 or higher but lower than 1,500 having the substantially same main chain structure as the organic polymer(a). COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006249249(A) |
申请公布日期 |
2006.09.21 |
申请号 |
JP20050067879 |
申请日期 |
2005.03.10 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SHIMOMURA YORIKO;FUKUI KOJI |
分类号 |
C08L101/10;C08K3/00;C08L71/00;C09J11/04;C09J171/00;C09J201/10;C09K3/10 |
主分类号 |
C08L101/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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