发明名称 CURABLE COMPOSITION, SEALANT AND ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a low-viscosity and thixotropic curable composition curing by ambient humidity and giving a rubbery cured product, and to provide a sealant and an adhesive each using the composition. SOLUTION: The curable composition comprises (a) an organic polymer containing crosslinkable hydrolyzable silyl group and (b) an organic polymer with a number-average molecular weight of 500 or higher but lower than 1,500 having the substantially same main chain structure as the organic polymer(a). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006249249(A) 申请公布日期 2006.09.21
申请号 JP20050067879 申请日期 2005.03.10
申请人 SEKISUI CHEM CO LTD 发明人 SHIMOMURA YORIKO;FUKUI KOJI
分类号 C08L101/10;C08K3/00;C08L71/00;C09J11/04;C09J171/00;C09J201/10;C09K3/10 主分类号 C08L101/10
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