| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pad for chemical mechanical polishing having a region to pass end point detection light through the pad without deteriorating polishing performance, and a chemical mechanical polishing method, in chemical mechanical polishing with a water-sealed end point detector. <P>SOLUTION: The pad 1 for chemical mechanical polishing is formed of a non-water-soluble matrix and water-soluble particles dispersed in the non-water-soluble matrix, and has a polishing surface and a non-polishing surface opposite from the polishing surface. The pad 1 has a translucent region which is an optical way leading from the polishing surface to the non-polishing surface, and the non-polishing surface of the translucent region has a surface roughness (Ra) of 10 μm or less. Using this pad, chemical mechanical polishing is made. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
