| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing apparatus in which various processes can be continuously performed in a single semiconductor device manufacturing apparatus and efficient processes can be implemented to a small amount of wafers. SOLUTION: The semiconductor device manufacturing apparatus comprises a chamber zone provided with at least two process chambers, a cooling zone which is disposed adjacent to the chamber zone to cool the wafer heated in the chamber and buffer a substrate whose processing has been finished in the chamber zone; a loading zone for mounting and extracting the wafer on and from a wafer boat; a transfer means for transferring the wafer boat to the chamber zone, cooling zone, and loading zone; and a control unit for controlling the operations of the chamber zone, cooling zone, and transfer means. COPYRIGHT: (C)2006,JPO&NCIPI
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