发明名称 Halbleiteranordnung mit zwei mit einem Erdungsanschluss verbundenen Erdungsverbindungspunkten und Testverfahren dafür
摘要 Integrated circuit (3) has terminal (F1) connected to two semiconductor contact studs (P1a, P1b) such that the geometrical and electrical characteristics between the doubly earthed terminal and two others are equal or nearly equal enabling earth continuity to be established by voltage comparison. Semiconductor (2) has contact studs (P) connected to terminals (F) by wires (W), and entirely encapsulated to form an integrated circuit (IC), of which one terminal (F1) is connected to two earth contact studs (P1a, P1b) such that normal continuity tests do not reveal failure of only one of the wires (W1a,W1b) due to action of substratum. The IC is manufactured such that the geometrical and electrical characteristics between the doubly earthed terminal (F1) and two other terminals (F2, F3) are equal or very nearly equal. Generators (9,10) apply currents to these two circuits and the terminal voltages are measured (11,12) and sequenced (13). The difference (14) between the two voltages is compared (15) with a threshold (16) to determine healthy conditions or otherwise.
申请公布号 DE69831457(T2) 申请公布日期 2006.06.29
申请号 DE1998631457T 申请日期 1998.09.21
申请人 STMICROELECTRONICS S.A., MONTROUGE 发明人 MONNOT, GILLES
分类号 H01L23/50;G01R31/28;G01R31/316 主分类号 H01L23/50
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