发明名称 |
Sheet removing apparatus and method |
摘要 |
<p>A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.</p> |
申请公布号 |
EP1128415(A3) |
申请公布日期 |
2006.05.31 |
申请号 |
EP20010100463 |
申请日期 |
2001.01.08 |
申请人 |
LINTEC CORPORATION |
发明人 |
TSUJIMOTO, MASAKI;KOBAYASHI, KENJI;KAWASAKI, KIMIHIKO |
分类号 |
B65H29/54;H01L21/00;B65H41/00;H01L21/301;H01L21/683 |
主分类号 |
B65H29/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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