发明名称 MULTI-LAYER WIRING BOARD AND SIGNAL STABILIZATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a multi-layer wiring board and a signal stabilization method by which stabilization of a high-frequency signal made to pass a transmission line composed by connecting a signal line of a microstrip line and that of a strip line. <P>SOLUTION: The transmission line is composed by connecting the signal line 12a of the microstrip line, the signal line 14b of the strip line, and the signal line 16a of the microstrip line through vias 13, 15 penetrated through an insulating layer. The transmission line is incorporated into the multi-layer wiring board 10. The width Wm of the signal lines 12a, 16a of the microstrip line and the width of the signal line 14b of the strip line are adjusted so that characteristic impedances Zm, Zs of the mutual signal lines 12a, 14b, and 16a become almost equal. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006086825(A) 申请公布日期 2006.03.30
申请号 JP20040269652 申请日期 2004.09.16
申请人 SEIKO EPSON CORP 发明人 SHIODA FUMIO
分类号 H01P3/08;H05K3/46 主分类号 H01P3/08
代理机构 代理人
主权项
地址