发明名称 |
Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus |
摘要 |
A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.
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申请公布号 |
US2006060944(A1) |
申请公布日期 |
2006.03.23 |
申请号 |
US20050196677 |
申请日期 |
2005.08.04 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SHINTATE TSUYOSHI;SAKURADA KAZUAKI;YAMADA JUN |
分类号 |
H01L29/06;H01L23/495;H01L27/082 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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