METHOD OF MANUFACTURING A SOLID-STATE IMAGE SENSING APPARATUS

摘要

A solid-state image sensing apparatus having a three-dimensional structure whose manufacturing process can be simplified is provided. A solid-state image sensing apparatus formed by bonding a first member ( 104 ) and a second member ( 108 ) is provided. The first member ( 104 ) has a first surface on the side of the bonding interface between the first member ( 104 ) and the second member ( 108 ) and a second surface on the opposite side of the bonding interface. The second member ( 108 ) has a third surface on the bonding interface side and a fourth surface on the opposite side of the bonding interface. The first member ( 104 ) includes photoelectric conversion elements ( 105 ) which are formed on the first surface before the first member ( 104 ) is bonded to the second member ( 108 ). The second member ( 108 ) includes circuit elements ( 106 ) which are formed on the third surface before bonding.