| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize high speed bonding process for loading semiconductor chips on a wiring substrate, and to improve manufacturing yield of semiconductor package. <P>SOLUTION: The paste coating apparatus 30 is formed of a drive unit and a movable unit supported with the drive unit. The movable unit is provided with a holder body 40 moving in vertical direction along a main spindle 36 with rotation of the motor 31 of the drive unit and a nozzle holder 41 screwed to this holder body 40. The nozzle holder 41 is provided with a nozzle 43 mounted to the lower end of a shringe 42 by the screwing. The paste coating apparatus 30 detects amount of displacement by aging of the movable unit for the drive unit by utilizing a height sensor 37 fixed to the main spindle supporting unit 34 of the drive unit, and compensates for lowering distance of the movable unit on the basis of such positional displacement. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
