| 摘要 |
A SEMICONDUCTOR DEVICE COMPRISING A PACKAGE (34) FORMED OF A THERMOPLASTIC RESIN, FIRST AND SECOND LEAD FRAMES (31, 32) ARRANGED PARALLEL TO EACH OTHER WITH A PREDETERMINED SPACE INTERPOSED THEREBETWEEN, AND EACH HAVING A DISTAL END PORTION OF A PREDETERMINED LENGTH (D1) LOCATED IN THE PACKAGE (34), SOLDER FILMS (36A, 36B) FORMED ON THE FIRST AND SECOND LEAD FRAMES (31, 32) FROM OUTSIDE THE PACKAGE (34) TO INSIDE THE PACKAGE (34), A SEMICONDUCTOR ELEMENT (33) MOUNTED ON THE DISTAL END PORTION OF THE FIRST LEAD FRAME (31) AND HAVING AN ELECTRODE (E), AND A BONDING WIRE (33A) HAVING AN END CONNECTED TO THE ELECTRODE (E) OF THE SEMICONDUCTOR ELEMENT (33), AND ANOTHER END CONNECTED TO THE DISTAL END PORTION OF THE SECOND LEAD FRAME (32). |
