| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive film for permanent pattern formation having high heat resistance, a high surface hardness and a low coefficient of thermal expansion, exhibiting such proper properties of followability of the irregularities of a substrate surface as not to cause faulty adhesion, less liable to lower exposure sensitivity, ensuring proper work efficiency in solder resist formation, excellent in storage stability, and having satisfactory sensitivity with respect to an LDI that it can be suitably used, and to provide a method for producing the same and a permanent pattern forming method that uses the photosensitive film for permanent pattern formation. <P>SOLUTION: The photosensitive film for permanent pattern formation has a support, an alkali-soluble cushion layer containing a thermoplastic resin, a barrier layer capable of suppressing transfer of a substance and a photosensitive layer in this order, wherein the photosensitive layer comprises a photosensitive composition containing (A) a binder, (B) a polymerizable compound, (C) a photopolymerization initiator and (D) an extender, and wherein the interlayer adhesive force between the support and the cushion layer is smallest among the interlayer adhesive forces between the constituent layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
