| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning equipment, having a polishing component which will not cause peeling of abrasive grain, will not affect a suction surface where contaminants, scrap, etc., involved in polishing will not affect the suction surface accompanying polishing, and the adhesion, of wafer will not adhere to the suction surface, when cleaning the suction surface of a mounting nozzle, and to provide a cleaning method therefor. SOLUTION: The cleaning equipment is used in an electronic component mounting machine, and the mounting machine has a mounting nozzle for mounting an electronic component on a circuit board, and the suction surface which sucks and holds the electronic component is provided at the tip of the mounting nozzle. The cleaning equipment includes a means of polishing for scrubbing the suction surface of the mounting nozzle and a means of driving for making the polishing means move in the predetermined direction. The polishing means is made of a ceramic structure, and the grain size at contact surface of the polishing means which contacts with the suction surface of the mounting nozzle is P1,000 to P5,000. COPYRIGHT: (C)2006,JPO&NCIPI |
