发明名称 Mold apparatus
摘要 A mold apparatus having at least a pair of molds formed with a cavity, at least one pipe accommodator formed in the molds, at least one heat pipe mounted in the pipe accommodator, a heat-cool source part connected to the heat pipe the heat and cool the heat pipe, and a controller to control the heat-cool source part to selectively heat and cool the heat pipe. Thus a mold apparatus to reduce a molding cycle and improve the quality of a molded product's appearance is provided.
申请公布号 US2005276875(A1) 申请公布日期 2005.12.15
申请号 US20050142232 申请日期 2005.06.02
申请人 LEE JONG-WON 发明人 LEE JONG-WON
分类号 B29C45/73;(IPC1-7):B29C45/73 主分类号 B29C45/73
代理机构 代理人
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