| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized mount module wherein a semiconductor chip is mounted on a bent and swollen circuit board with flip-chip connection with electric and mechanical reliability. SOLUTION: A joining planar part 2c for configuring a flat surface 2b formed to each of stud bump 4a provided to the circuit board 2 arranged to a reference plane 10 is deposited to the semiconductor chip 3 provided with terminal electrodes 3a opposed to each other, to set each of electrode planes 3b and each of the joining planar parts 2c to a parallel positional relation. Then each of the terminal electrodes 3a of the semiconductor chip 3 is located on each of the joining planar parts 2c formed to each of the stud bumps 4a. In this case, each electrode plane 3b of each of the terminal electrodes 3a provided to the semiconductor chip 3 and each joining planar part 2c of each stud bump 4a provided to the circuit board 2 are brought into a uniform contact state. The semiconductor chip 3 and the circuit board 2 are joined and fixed to each other through the thermocompression bonding at a prescribed temperature under a prescribed pressure. COPYRIGHT: (C)2006,JPO&NCIPI |
