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发明名称
Flip-chip bonder
摘要
申请公布号
KR100529863(B1)
申请公布日期
2005.11.22
申请号
KR20030051335
申请日期
2003.07.25
申请人
发明人
分类号
H01L23/48;(IPC1-7):H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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