发明名称 COMPOSITE MODULAR BARRIER STRUCTURES AND PACKAGES
摘要 A composite multi-layer barrier is produced by first vapor depositing a barrier (30,32) under vacuum over a substrate of interest (14) and then depositing an additional barrier at atmospheric pressure in a preferably thermoplastic layer (34). The resulting multi-layer barrier is then used to coat an article of interest (40) in a lamination process wherein the thermoplastic layer (34) is fused onto itself and the surface of the article. The vacuum-deposited barrier may consists of a first leveling polymer layer (46) followed by an inorganic barrier material (30) sputtered over the leveling layer and of an additional polymeric layer (32) flash evaporated, deposited, and cured under vacuum. The thermoplastic polymeric layer (34) is then deposited by extrusion, drawdown or roll coating at atmospheric pressure. The resulting multi-layer barrier may be stacked using the thermoplastic layer as bonding agent. Nano-particles (36) may be included in the thermoplastic layer to improve the barrier properties of the structure. A desiccant material may also be included or added as a separate layer (62).
申请公布号 WO2005108215(A2) 申请公布日期 2005.11.17
申请号 WO2005US14715 申请日期 2005.05.02
申请人 SIGMA LABORATORIES OF ARIZONA, INC.;YIALIZIS, ANGELO;MIKHAEL, MICHAEL, G. 发明人 YIALIZIS, ANGELO;MIKHAEL, MICHAEL, G.
分类号 B32B7/02;B32B27/06;B65D1/00;B65D65/40 主分类号 B32B7/02
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