| 摘要 |
<P>PROBLEM TO BE SOLVED: To suck and support by a jig a collectively resin-sealed body having a generated warp when individualizing it into individual device regions by a rotational cutter in the state of supporting it by the jig, with respect to the collectively resin-sealed body wherein a wiring board having semiconductor chips provided respectively in the plurality of device regions is resin-sealed collectively. <P>SOLUTION: The contact of a jig 10 with a collectively resin-sealed body 20 is so shaped that it is provided in the more inside region than an outermost peripheral dicing line 15a provided in the supporting portion 12 of the jig 10. As far as such a shape is used, even in the state wherein the collectively resin-sealed body 20 having a generated upward convex warp is mounted on the supporting portion 12 of the jig 10, the side of the outer edge 22a of the collectively resin-sealed body 20 can be made lower than the sucking surface 12a of the supporting portion 12. Therefore, the space between the supporting portion 12 and a resin which tends to be made large in the case of the resin having a convex warp can be made small, and the collectively resin-sealed body 20 having a warp can be sucked and supported effectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
