ADHESIVE TAPE

摘要

The present invention provides an adhesive tape prepared by coating the one side or both sides of a substrate film with an adhesive composition including an acrylonitrile-butadiene copolymer or an acrylonitrile-butadiene-acrylic acid terpolymer containing carboxyl groups, an epoxy resin, a modified epoxy resin, a curing agent, an antioxidant, a filler, and other additives, the adhesive tape being excellent in thermal shrinkage and outgas rate to guarantee a high reliability in the semiconductor chip manufacturing process.