| 发明名称 |
Multi-chip flip package with substrate for inter-die coupling |
| 摘要 |
A method comprising coupling a substrate interconnect to a substrate pad, attaching at least two flip chips to said substrate interconnect to electrically connect together said chips, and coupling at least one lead to each of the chips.
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| 申请公布号 |
US2005230842(A1) |
申请公布日期 |
2005.10.20 |
| 申请号 |
US20040827836 |
申请日期 |
2004.04.20 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SWANSON LELAND S.;BOYD WILLIAM D. |
| 分类号 |
H01L23/48;H01L23/495;H01L23/498;H01L25/065;H01L25/16;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
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