发明名称 |
Method of preparing a silicon dioxide layer by high temperature oxidation on a substrate having, at least on the surface, germanium or a silicon-germanium alloy |
摘要 |
Method of preparing a silicon dioxide layer by high-temperature oxidation on a substrate of formula Si<SUB>1-x</SUB>Ge<SUB>x </SUB>in which x is greater than 0 and less than or equal to 1, the said method comprising the following successive steps: a) at least one additional layer of thickness h<SUB>y </SUB>and of overall formula Si<SUB>1-y</SUB>Ge<SUB>y</SUB>, in which y is greater than 0 and less than x, is deposited on the said substrate of formula Si<SUB>1-x</SUB>Ge<SUB>x</SUB>; and b) the high-temperature oxidation of the said additional layer of overall formula Si<SUB>1-y</SUB>Ge<SUB>y </SUB>is carried out, whereby the said additional layer is completely or partly converted into a layer of silicon oxide SiO<SUB>2</SUB>. Method of preparing an optical or electronic component, comprising at least one step for preparing an SiO<SUB>2 </SUB>layer using the method described above.
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申请公布号 |
US2005215071(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20050090426 |
申请日期 |
2005.03.25 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
MORICEAU HUBERT;MUR PIERRE |
分类号 |
H01L21/20;H01L21/316;H01L21/762;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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