发明名称 Method of preparing a silicon dioxide layer by high temperature oxidation on a substrate having, at least on the surface, germanium or a silicon-germanium alloy
摘要 Method of preparing a silicon dioxide layer by high-temperature oxidation on a substrate of formula Si<SUB>1-x</SUB>Ge<SUB>x </SUB>in which x is greater than 0 and less than or equal to 1, the said method comprising the following successive steps: a) at least one additional layer of thickness h<SUB>y </SUB>and of overall formula Si<SUB>1-y</SUB>Ge<SUB>y</SUB>, in which y is greater than 0 and less than x, is deposited on the said substrate of formula Si<SUB>1-x</SUB>Ge<SUB>x</SUB>; and b) the high-temperature oxidation of the said additional layer of overall formula Si<SUB>1-y</SUB>Ge<SUB>y </SUB>is carried out, whereby the said additional layer is completely or partly converted into a layer of silicon oxide SiO<SUB>2</SUB>. Method of preparing an optical or electronic component, comprising at least one step for preparing an SiO<SUB>2 </SUB>layer using the method described above.
申请公布号 US2005215071(A1) 申请公布日期 2005.09.29
申请号 US20050090426 申请日期 2005.03.25
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 MORICEAU HUBERT;MUR PIERRE
分类号 H01L21/20;H01L21/316;H01L21/762;(IPC1-7):H01L21/31 主分类号 H01L21/20
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